MCP2021T-500E/MF
vs
MCP2021-E/SL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
SOIC
Package Description
6 X 5 MM, LEAD FREE, PLASTIC, DFN-8
3.90 MM, LEAD FREE, PLASTIC, SOIC-14
Pin Count
8
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-N8
S-PDSO-G14
JESD-609 Code
e3
e3
Length
6 mm
8.65 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
14
Number of Transceivers
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.24
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Screening Level
TS 16949
Seated Height-Max
1 mm
1.75 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
LIN TRANSCEIVER
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
5 mm
3.9 mm
Base Number Matches
1
1
Pbfree Code
Qualification Status
Not Qualified
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Compare MCP2021-E/SL with alternatives