MCP2021T-330E/MF
vs
MCP2021P-E/ST
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DFN
|
|
Package Description |
6 X 5 MM, LEAD FREE, PLASTIC, DFN-8
|
TSSOP-14
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
|
Length |
6 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
14
|
Number of Transceivers |
1
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
TSSOP
|
Package Equivalence Code |
SOLCC8,.24
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
LIN TRANSCEIVER
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
5 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP2021T-330E/MF with alternatives
Compare MCP2021P-E/ST with alternatives