MCP2021P-E/ST
vs
MCP2021AT-330E/MDVAO
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TSSOP-14
DFN-8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G14
S-PDSO-N8
Length
5 mm
4 mm
Number of Functions
1
1
Number of Terminals
14
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVSON
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level
TS 16949
AEC-Q100; TS 16949
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
LIN TRANSCEIVER
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4 mm
Base Number Matches
1
1
ECCN Code
EAR99
Number of Transceivers
1
Package Equivalence Code
SOLCC8,.16,32
Compare MCP2021P-E/ST with alternatives
Compare MCP2021AT-330E/MDVAO with alternatives