MCP2021-500E/MDVAO
vs
MCP2021AT-330E/SN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
End Of Life
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
DFN-8
SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PDSO-N8
R-PDSO-G8
Length
4 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.16,32
SOP8,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Screening Level
AEC-Q100; TS 16949
TS 16949
Seated Height-Max
1 mm
1.75 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
LIN TRANSCEIVER
CAN TRANSCEIVER
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4 mm
3.9 mm
Base Number Matches
1
4
Rohs Code
Samacsys Manufacturer
Microchip
JESD-609 Code
e3
Terminal Finish
MATTE TIN
Compare MCP2021-500E/MDVAO with alternatives
Compare MCP2021AT-330E/SN with alternatives