MCP1824S-1802E/DB
vs
MCP1824T-1802E/DC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOT-223
|
SOT-223
|
Package Description |
SOP, SOT-223
|
SOP, SOT-223-5
|
Pin Count |
4
|
6
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustability |
FIXED
|
FIXED
|
Dropout Voltage1-Max |
0.32 V
|
0.32 V
|
Dropout Voltage1-Nom |
0.2 V
|
0.2 V
|
Input Voltage Absolute-Max |
6.5 V
|
6.5 V
|
Input Voltage-Max |
6 V
|
6 V
|
Input Voltage-Min |
2.1 V
|
2.1 V
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
e3
|
Length |
6.5 mm
|
6.5 mm
|
Line Regulation-Max |
0.0119%
|
0.011934%
|
Load Regulation-Max |
0.018%
|
0.018%
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
3
|
5
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.3 A
|
0.3 A
|
Output Voltage1-Max |
1.845 V
|
1.845 V
|
Output Voltage1-Min |
1.755 V
|
1.755 V
|
Output Voltage1-Nom |
1.8 V
|
1.8 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOT-223
|
SOT-223-5
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Seated Height-Max |
1.8 mm
|
1.8 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn) - annealed
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
2.3 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Tolerance-Max |
2.5%
|
2.5%
|
Width |
3.5 mm
|
3.5 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
16 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Screening Level |
|
TS 16949
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP1824S-1802E/DB with alternatives
Compare MCP1824T-1802E/DC with alternatives