MCP1812AT-033/LB
vs
MCP1812AT-033/HCA
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TSSOP, TSSOP3/6,.08
|
HVSON, SOLCC4,.04,25
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Adjustability |
FIXED
|
FIXED
|
Dropout Voltage1-Max |
0.6 V
|
0.6 V
|
Dropout Voltage1-Nom |
0.4 V
|
0.4 V
|
Input Voltage Absolute-Max |
6 V
|
6 V
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
3.9 V
|
3.9 V
|
JESD-30 Code |
R-PDSO-G3
|
S-PDSO-N4
|
Length |
2 mm
|
1 mm
|
Load Regulation-Max |
0.05%
|
0.05%
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
3
|
4
|
Operating Temperature TJ-Max |
85 °C
|
85 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.3 A
|
0.3 A
|
Output Voltage1-Max |
3.432 V
|
3.432 V
|
Output Voltage1-Min |
3.168 V
|
3.168 V
|
Output Voltage1-Nom |
3.3 V
|
3.3 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
HVSON
|
Package Equivalence Code |
TSSOP3/6,.08
|
SOLCC4,.04,25
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Seated Height-Max |
1.1 mm
|
0.6 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Voltage Tolerance-Max |
4%
|
4%
|
Width |
1.25 mm
|
1 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP1812AT-033/LB with alternatives
Compare MCP1812AT-033/HCA with alternatives