MCP1754ST-3002E/MC
vs
MCP1754S-3002E/DB
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVSON,
|
HSOP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustability |
FIXED
|
FIXED
|
Dropout Voltage1-Max |
0.5 V
|
0.5 V
|
Dropout Voltage1-Nom |
0.3 V
|
0.3 V
|
Input Voltage Absolute-Max |
17.6 V
|
17.6 V
|
Input Voltage-Max |
16 V
|
16 V
|
Input Voltage-Min |
3.6 V
|
3.6 V
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
6.5 mm
|
Line Regulation-Max |
0.0186%
|
0.0186%
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
3
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.15 A
|
0.15 A
|
Output Voltage1-Max |
3.06 V
|
3.06 V
|
Output Voltage1-Min |
2.94 V
|
2.94 V
|
Output Voltage1-Nom |
3 V
|
3 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HSOP
|
Package Equivalence Code |
SOLCC8,.08,20
|
SOT-223
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG
|
Packing Method |
TR
|
TUBE
|
Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
1.8 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
2.3 mm
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Tolerance-Max |
2%
|
2%
|
Width |
2 mm
|
3.5 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP1754ST-3002E/MC with alternatives
Compare MCP1754S-3002E/DB with alternatives