MCP1701AT-3002I/CB vs TC55RP3002EZB723 feature comparison

MCP1701AT-3002I/CB Microchip Technology Inc

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TC55RP3002EZB723 Telcom Semiconductor Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TELCOM SEMICONDUCTOR INC
Part Package Code SOT-23A
Package Description PLASTIC, EIAJ, SC-59, SOT-23A, 3 PIN ,
Pin Count 3
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 16 Weeks
Samacsys Manufacturer Microchip
Adjustability FIXED
Dropout Voltage1-Max 0.7 V 0.7 V
Dropout Voltage1-Nom 0.4 V 0.4 V
Input Voltage Absolute-Max 12 V
Input Voltage-Max 10 V 10 V
Input Voltage-Min 4 V
JESD-30 Code R-PDSO-G3 O-PBCY-W3
JESD-609 Code e3
Length 2.9 mm
Line Regulation-Max 0.054%
Load Regulation-Max 0.09%
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Outputs 1
Number of Terminals 3 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Current1-Max 0.15 A 0.15 A
Output Voltage1-Max 3.06 V 3.06 V
Output Voltage1-Min 2.94 V 2.94 V
Output Voltage1-Nom 3 V 3 V
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP BCY
Package Equivalence Code TO-236
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH CYLINDRICAL
Packing Method TR
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Regulator Type FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Screening Level TS 16949
Seated Height-Max 1.45 mm
Surface Mount YES NO
Technology CMOS CMOS
Terminal Finish MATTE TIN
Terminal Form GULL WING WIRE
Terminal Pitch 0.95 mm
Terminal Position DUAL BOTTOM
Voltage Tolerance-Max 2% 2%
Width 1.5 mm
Base Number Matches 1 1

Compare MCP1701AT-3002I/CB with alternatives

Compare TC55RP3002EZB723 with alternatives