MCP1700T-3302E/TTVAO
vs
FT510GC
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
FREMONT MICRO DEVICES LTD
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Adjustability |
FIXED
|
|
Dropout Voltage1-Max |
0.35 V
|
|
Dropout Voltage1-Nom |
0.178 V
|
0.15 V
|
Input Voltage Absolute-Max |
6.5 V
|
|
Input Voltage-Max |
6 V
|
6 V
|
Input Voltage-Min |
4.3 V
|
4.3 V
|
JESD-30 Code |
R-PDSO-G3
|
R-PSSO-F3
|
JESD-609 Code |
e3
|
|
Length |
2.9 mm
|
4.5 mm
|
Line Regulation-Max |
0.0561%
|
|
Load Regulation-Max |
0.0495%
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
|
Number of Terminals |
3
|
3
|
Operating Temperature TJ-Max |
125 °C
|
|
Operating Temperature TJ-Min |
-40 °C
|
|
Output Current1-Max |
0.25 A
|
0.25 A
|
Output Voltage1-Max |
3.399 V
|
3.366 V
|
Output Voltage1-Min |
3.201 V
|
3.234 V
|
Output Voltage1-Nom |
3.3 V
|
3.3 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HSOF
|
Package Equivalence Code |
TO-236
|
TO-243
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Screening Level |
AEC-Q100; TS 16949
|
|
Seated Height-Max |
1.12 mm
|
1.6 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
0.95 mm
|
1.5 mm
|
Terminal Position |
DUAL
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Voltage Tolerance-Max |
3%
|
2%
|
Width |
1.3 mm
|
2.45 mm
|
Base Number Matches |
1
|
1
|
Package Description |
|
,
|
|
|
|
Compare MCP1700T-3302E/TTVAO with alternatives
Compare FT510GC with alternatives