MCP1633-E/MGVAO
vs
TPS63060DSC
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
QFN-16
|
HVSON,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
12 V
|
| Input Voltage-Min |
3 V
|
2.5 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
S-PQCC-N16
|
S-PDSO-N10
|
| Length |
3 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
10
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVSON
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
0.9 mm
|
0.8 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK-BOOST
|
BUCK-BOOST
|
| Switching Frequency-Max |
2200 kHz
|
2600 kHz
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SON
|
| Pin Count |
|
10
|
| Output Current-Max |
|
1 A
|
|
|
|
Compare MCP1633-E/MGVAO with alternatives
Compare TPS63060DSC with alternatives