MCP101-475DI/TO
vs
DS1812R-5+T&R
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
|
| Package Description |
,
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
3-SOT_23-N/A
|
| Pin Count |
|
3
|
| Manufacturer Package Code |
|
3-SOT_23-N/A
|
| Date Of Intro |
|
1999-11-19
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Additional Feature |
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
|
| Adjustable Threshold |
|
NO
|
| Analog IC - Other Type |
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
|
R-PDSO-G3
|
| JESD-609 Code |
|
e3
|
| Length |
|
2.92 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TO-236
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.12 mm
|
| Supply Current-Max (Isup) |
|
0.04 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.95 mm
|
| Terminal Position |
|
DUAL
|
| Threshold Voltage-Nom |
|
+4.62V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
1.3 mm
|
|
|
|
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