MCP0805F221PB-T
vs
CIB21P110AC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Unknown
|
| Ihs Manufacturer |
AEM INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
0805
|
0805
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8504.50.80.00
|
|
| Case Code |
0805
|
0805
|
| Construction |
Multilayer Chip
|
Chip Bead
|
| DC Resistance-Max |
0.05 Ω
|
0.05 Ω
|
| Filter Type |
FERRITE CHIP
|
|
| Frequency-Max |
100 MHz
|
100 MHz
|
| Frequency-Min |
100 MHz
|
100 MHz
|
| Height |
0.9 mm
|
0.9 mm
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2 mm
|
2 mm
|
| Mounting Type |
SURFACE MOUNT
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Impedance |
220 OHM Ω
|
|
| Packing Method |
BULK
|
Tape, Paper
|
| Rated Current |
2 A
|
2 A
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
1
|
2
|
| Material |
|
Ferrite
|
| Physical Dimension |
|
L2XB1.25XH.9 (mm)/L.0787XB.0492XH.0354 (inch)
|
| Series |
|
CIB
|
|
|
|
Compare MCP0805F221PB-T with alternatives