MCM93422DC
vs
AM93422ADM
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
DIP, DIP22,.4
|
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
45 ns
|
|
JESD-30 Code |
R-XDIP-T22
|
|
JESD-609 Code |
e0
|
|
Memory Density |
1024 bit
|
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
|
Number of Terminals |
22
|
|
Number of Words |
256 words
|
|
Number of Words Code |
256
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
256X4
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP22,.4
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Parallel/Serial |
PARALLEL
|
|
Power Supplies |
5 V
|
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
TTL
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Base Number Matches |
3
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.41
|
|
|
|