MCM69R821AZP4.2
vs
CY7C1306V25-100BZC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
CYPRESS SEMICONDUCTOR CORP
Package Description
BGA, BGA119,7X17,50
13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Reach Compliance Code
unknown
compliant
Access Time-Max
5.5 ns
3 ns
I/O Type
COMMON
SEPARATE
JESD-30 Code
R-PBGA-B119
R-PBGA-B165
JESD-609 Code
e0
e0
Memory Density
4718592 bit
18874368 bit
Memory IC Type
LATE-WRITE SRAM
QDR SRAM
Memory Width
18
36
Number of Terminals
119
165
Number of Words
262144 words
524288 words
Number of Words Code
256000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
512KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Equivalence Code
BGA119,7X17,50
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Power Supplies
1.5,3.3 V
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
3.15 V
2.4 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
3
1
Pbfree Code
Part Package Code
BGA
Pin Count
165
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
100 MHz
Length
15 mm
Moisture Sensitivity Level
3
Number of Functions
1
Peak Reflow Temperature (Cel)
220
Seated Height-Max
1.2 mm
Standby Current-Max
0.06 A
Supply Current-Max
0.33 mA
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Width
13 mm
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