MCM69R819ZP6
vs
CY7C1372AV25-100BGC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
CYPRESS SEMICONDUCTOR CORP
Package Description
BGA,
14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
3
1
Pbfree Code
Part Package Code
BGA
Pin Count
119
Access Time-Max
5 ns
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
18874368 bit
Memory IC Type
ZBT SRAM
Memory Width
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
119
Number of Words
1048576 words
Number of Words Code
1000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
1MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Seated Height-Max
2.4 mm
Standby Current-Max
0.03 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.25 mA
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
14 mm
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