MCM69R819AZP6 vs MCM69F737ZP7.5 feature comparison

MCM69R819AZP6 Motorola Semiconductor Products

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MCM69F737ZP7.5 Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Package Description 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 BGA,
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 7.5 ns
Additional Feature BYTE WRITE CONTROL; BOUNDARY SCAN OPTIONAL INTERLEAVED OR LINEAR BURST; BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type LATE-WRITE SRAM CACHE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 119 119
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 128KX36
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.15 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 4 4
Part Package Code BGA
Pin Count 119

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Compare MCM69F737ZP7.5 with alternatives