MCM69R819AZP6
vs
MCM69F737ZP7.5
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
7.5 ns
Additional Feature
BYTE WRITE CONTROL; BOUNDARY SCAN
OPTIONAL INTERLEAVED OR LINEAR BURST; BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e0
Length
22 mm
22 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
LATE-WRITE SRAM
CACHE SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
119
119
Number of Words
262144 words
131072 words
Number of Words Code
256000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
128KX36
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
2.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3.15 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
4
4
Part Package Code
BGA
Pin Count
119
Compare MCM69R819AZP6 with alternatives
Compare MCM69F737ZP7.5 with alternatives