MCM69R618ZP7
vs
MCM69R618ZP7R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA119,7X17,50
BGA,
Pin Count
119
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.5 ns
3.5 ns
Additional Feature
BYTE WRITE CONTROL; BOUNDARY SCAN
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
22 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
LATE-WRITE SRAM
LATE-WRITE SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
Number of Terminals
119
119
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX18
64KX18
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
2.4 mm
Standby Voltage-Min
3.15 V
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
3
3
Compare MCM69R618ZP7 with alternatives
Compare MCM69R618ZP7R with alternatives