MCM69L738ZP7R
vs
IS61DDP2B21M36A-400B4L
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
INTEGRATED SILICON SOLUTION INC
|
| Package Description |
BGA,
|
LBGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
165
|
| Access Time-Max |
|
0.45 ns
|
| JESD-30 Code |
|
R-PBGA-B165
|
| Length |
|
15 mm
|
| Memory Density |
|
37748736 bit
|
| Memory IC Type |
|
DDR SRAM
|
| Memory Width |
|
36
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
165
|
| Number of Words |
|
1048576 words
|
| Number of Words Code |
|
1000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
1MX36
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LBGA
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.4 mm
|
| Supply Voltage-Max (Vsup) |
|
1.89 V
|
| Supply Voltage-Min (Vsup) |
|
1.71 V
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
13 mm
|
|
|
|
Compare MCM69L738ZP7R with alternatives
Compare IS61DDP2B21M36A-400B4L with alternatives