MCM69L618ZP9.5R
vs
MCM69F618ZP10
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BGA
Package Description
BGA,
BGA, BGA119,7X17,50
Pin Count
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
9.5 ns
10 ns
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Length
22 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
18
18
Number of Functions
1
Number of Ports
1
Number of Terminals
119
119
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64KX18
64KX18
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
Base Number Matches
2
3
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Package Equivalence Code
BGA119,7X17,50
Power Supplies
3.3 V
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.25 mA
Terminal Finish
Tin/Lead (Sn/Pb)
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