MCM67M618AFN9
vs
MT58LC64K18D7EJ-4.5LTR
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICRON TECHNOLOGY INC
|
| Package Description |
QCCJ,
|
QCCJ,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
9 ns
|
4.5 ns
|
| JESD-30 Code |
S-PQCC-J52
|
S-PQCC-J52
|
| Length |
19.125 mm
|
19.1262 mm
|
| Memory Density |
1179648 bit
|
1179648 bit
|
| Memory IC Type |
CACHE SRAM
|
STANDARD SRAM
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
52
|
52
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64KX18
|
64KX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
19.125 mm
|
19.1262 mm
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
52
|
| JESD-609 Code |
|
e0
|
| Number of Ports |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Output Enable |
|
YES
|
| Qualification Status |
|
Not Qualified
|
| Standby Voltage-Min |
|
2 V
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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