MCM67M618AFN9
vs
KM718BV86J-12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
SAMSUNG SEMICONDUCTOR INC
Package Description
QCCJ,
QCCJ,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
9 ns
12 ns
JESD-30 Code
S-PQCC-J52
S-PQCC-J52
Length
19.125 mm
19.05 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
52
52
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64KX18
64KX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
4.57 mm
4.52 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
19.125 mm
19.05 mm
Base Number Matches
4
1
Part Package Code
LCC
Pin Count
52
Qualification Status
Not Qualified
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