MCM67M518FN11 vs KM718BV514J-9 feature comparison

MCM67M518FN11 Motorola Mobility LLC

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KM718BV514J-9 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC SAMSUNG SEMICONDUCTOR INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC52,.8SQ QCCJ,
Pin Count 52 52
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 11 ns 9 ns
Additional Feature SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE
I/O Type COMMON
JESD-30 Code S-PQCC-J52 S-PQCC-J52
JESD-609 Code e0
Length 19.1262 mm 19.05 mm
Memory Density 589824 bit 589824 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1
Number of Terminals 52 52
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX18 32KX18
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC52,.8SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.52 mm
Standby Current-Max 0.075 A
Standby Voltage-Min 4.75 V
Supply Current-Max 0.275 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 19.1262 mm 19.05 mm
Base Number Matches 1 1

Compare MCM67M518FN11 with alternatives

Compare KM718BV514J-9 with alternatives