MCM67H618BFN10
vs
MCM67B618BFN12
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA INC
|
Package Description |
QCCJ, LDCC52,.8SQ
|
QCCJ, LDCC52,.8SQ
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
10 ns
|
12 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PQCC-J52
|
S-PQCC-J52
|
JESD-609 Code |
e0
|
e0
|
Memory Density |
1179648 bit
|
1179648 bit
|
Memory IC Type |
STANDARD SRAM
|
CACHE SRAM
|
Memory Width |
18
|
18
|
Number of Terminals |
52
|
52
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
64KX18
|
64KX18
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC52,.8SQ
|
LDCC52,.8SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Power Supplies |
5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.095 A
|
0.095 A
|
Standby Voltage-Min |
4.75 V
|
4.75 V
|
Supply Current-Max |
0.265 mA
|
0.25 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
3
|
3
|
Pbfree Code |
|
No
|
Part Package Code |
|
LCC
|
Pin Count |
|
52
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Length |
|
19.1262 mm
|
Number of Functions |
|
1
|
Number of Ports |
|
1
|
Output Enable |
|
YES
|
Seated Height-Max |
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
|
5.25 V
|
Supply Voltage-Min (Vsup) |
|
4.75 V
|
Technology |
|
BICMOS
|
Width |
|
19.1262 mm
|
|
|
|
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