MCM67B518AFN8.5
vs
IDT71419S10J
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
QCCJ, LDCC52,.8SQ
|
PLASTIC, LCC-52
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Access Time-Max |
8.5 ns
|
10 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PQCC-J52
|
S-PQCC-J52
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
589824 bit
|
589824 bit
|
| Memory IC Type |
STANDARD SRAM
|
CACHE SRAM
|
| Memory Width |
18
|
18
|
| Number of Terminals |
52
|
52
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
32KX18
|
32KX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC52,.8SQ
|
LDCC52,.8SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.075 A
|
0.03 A
|
| Standby Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Current-Max |
0.29 mA
|
0.31 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
52
|
| ECCN Code |
|
3A991.B.2.B
|
| HTS Code |
|
8542.32.00.41
|
| Additional Feature |
|
BURST COUNTER; SELF TIMED WRITE; ADDRESS REGISTER
|
| Length |
|
19.1262 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Output Enable |
|
YES
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Seated Height-Max |
|
4.572 mm
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Technology |
|
BICMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
19.1262 mm
|
|
|
|
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