MCM63P819KZP150R
vs
AS7C331MNTF18A-75TQI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
ALLIANCE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
QFP
|
Package Description |
BGA,
|
LQFP,
|
Pin Count |
119
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
3.8 ns
|
7.5 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
FLOW-THROUGH ARCHITECTURE
|
JESD-30 Code |
R-PBGA-B119
|
R-PQFP-G100
|
JESD-609 Code |
e0
|
e0
|
Length |
22 mm
|
20 mm
|
Memory Density |
4718592 bit
|
18874368 bit
|
Memory IC Type |
CACHE SRAM
|
ZBT SRAM
|
Memory Width |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Terminals |
119
|
100
|
Number of Words |
262144 words
|
1048576 words
|
Number of Words Code |
256000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
256KX18
|
1MX18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LQFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.4 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
4
|
2
|
|
|
|
Compare AS7C331MNTF18A-75TQI with alternatives