MCM63F532TQ12
vs
71V432S7PFG
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LQFP,
|
14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-136DJ, TQFP-100
|
Pin Count |
100
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.B
|
3A991.B.2.B
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
12 ns
|
7 ns
|
Additional Feature |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
|
PIPELINED ARCHITECTURE
|
JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
Length |
20 mm
|
20 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
100
|
100
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Organization |
32KX32
|
32KX32
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
LQFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.63 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Clock Frequency-Max (fCLK) |
|
66 MHz
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Package Equivalence Code |
|
QFP100,.63X.87
|
Peak Reflow Temperature (Cel) |
|
260
|
Standby Current-Max |
|
0.015 A
|
Standby Voltage-Min |
|
3.14 V
|
Supply Current-Max |
|
0.16 mA
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCM63F532TQ12 with alternatives
Compare 71V432S7PFG with alternatives