MCM6343TS10BR
vs
IDT71V416S10BEI8
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSOP2
|
BGA
|
| Package Description |
TSOP2, TSOP44,.46,32
|
9 X 9 MM, BGA-48
|
| Pin Count |
44
|
48
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
10 ns
|
10 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDSO-G44
|
S-PBGA-B48
|
| Length |
18.41 mm
|
9 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
48
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
256KX16
|
256KX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP2
|
TFBGA
|
| Package Equivalence Code |
TSOP44,.46,32
|
BGA48,6X8,30
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Standby Current-Max |
0.008 A
|
0.02 A
|
| Standby Voltage-Min |
3.14 V
|
3 V
|
| Supply Current-Max |
0.2 mA
|
0.2 mA
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.75 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
10.16 mm
|
9 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
4
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Terminal Finish |
|
Tin/Lead (Sn63Pb37)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCM6343TS10BR with alternatives
Compare IDT71V416S10BEI8 with alternatives