MCM6343TS10B
vs
MCM6343TS10BR
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
TSOP2, TSOP44,.46,32
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
10 ns
|
|
| Additional Feature |
CONFIGURED AS 256K X 16; TTL COMPATIBLE INPUTS & OUTPUTS
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDSO-G44
|
|
| JESD-609 Code |
e0
|
|
| Length |
18.41 mm
|
|
| Memory Density |
4194304 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
CACHE SRAM
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
44
|
|
| Number of Words |
262144 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
256KX16
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSOP2
|
|
| Package Equivalence Code |
TSOP44,.46,32
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Standby Voltage-Min |
3.15 V
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
10.16 mm
|
|
| Base Number Matches |
4
|
4
|
|
|
|
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