MCM6343TS10B
vs
71V416S10BE8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Package Description
TSOP2, TSOP44,.46,32
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.B.2.A
NLR
HTS Code
8542.32.00.41
8542320041
Access Time-Max
10 ns
10 ns
Additional Feature
CONFIGURED AS 256K X 16; TTL COMPATIBLE INPUTS & OUTPUTS
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G44
S-PBGA-B48
JESD-609 Code
e0
e0
Length
18.41 mm
9 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX16
256KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Equivalence Code
TSOP44,.46,32
BGA48,6X8,30
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Voltage-Min
3.15 V
3 V
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3.15 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
0.75 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
9 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
CABGA
Pin Count
48
Manufacturer Package Code
BE48
Samacsys Manufacturer
Renesas Electronics
Moisture Sensitivity Level
4
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.02 A
Supply Current-Max
0.2 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare MCM6343TS10B with alternatives
Compare 71V416S10BE8 with alternatives