MCM6226AWJ20
vs
5962-9669116HYX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MICROSS COMPONENTS
|
| Part Package Code |
SOJ
|
DIP
|
| Package Description |
SOJ,
|
DIP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.B
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
20 ns
|
20 ns
|
| JESD-30 Code |
R-PDSO-J32
|
R-XDIP-T32
|
| JESD-609 Code |
e0
|
e4
|
| Length |
20.96 mm
|
41.91 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
128KX8
|
128KX8
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOJ
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.75 mm
|
5.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
PALLADIUM GOLD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
15.24 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MCM6226AWJ20 with alternatives
Compare 5962-9669116HYX with alternatives