MCM60L256APV10
vs
MT5C2564EC-35AT
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICRON TECHNOLOGY INC
|
| Package Description |
DIP, DIP28,.6
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Access Time-Max |
100 ns
|
35 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDIP-T28
|
R-PQCC-N28
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
4
|
| Number of Terminals |
28
|
28
|
| Number of Words |
32768 words
|
65536 words
|
| Number of Words Code |
32000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
105 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
32KX8
|
64KX4
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP28,.6
|
LCC28,.35X.55
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.00005 A
|
0.008 A
|
| Standby Voltage-Min |
2 V
|
4.5 V
|
| Supply Current-Max |
0.07 mA
|
0.1 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
3
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
|
|
|
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