MCM51L1000AP80 vs HM511000P-12S feature comparison

MCM51L1000AP80 Motorola Semiconductor Products

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HM511000P-12S Hitachi Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC HITACHI LTD
Package Description 0.300 INCH, PLASTIC, DIP-18 DIP, DIP18,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE FAST PAGE
Access Time-Max 80 ns 120 ns
Additional Feature RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS REFRESH
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PDIP-T18 R-PDIP-T18
JESD-609 Code e0 e0
Length 22.1 mm 22.26 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX1 1MX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 512 512
Seated Height-Max 4.57 mm 5.08 mm
Standby Current-Max 0.0002 A 0.001 A
Supply Current-Max 0.07 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Pbfree Code No
Part Package Code DIP
Pin Count 18

Compare MCM51L1000AP80 with alternatives

Compare HM511000P-12S with alternatives