MCM511001P12 vs TC511002AP-80 feature comparison

MCM511001P12 Motorola Semiconductor Products

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TC511002AP-80 Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Package Description DIP, DIP18,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode NIBBLE STATIC COLUMN
Access Time-Max 120 ns 80 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O Type SEPARATE
JESD-30 Code R-PDIP-T18 R-PDIP-T18
JESD-609 Code e0 e0
Length 22.1 mm 22 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type NIBBLE MODE DRAM STATIC COLUMN DRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX1 1MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 512 512
Seated Height-Max 4.57 mm 4.4 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Part Package Code DIP
Pin Count 18

Compare MCM511001P12 with alternatives

Compare TC511002AP-80 with alternatives