MCM36F8DG10
vs
CYM9272APM-50C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIMM
Package Description
,
DIMM, DIMM144,32
Pin Count
144
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10.3 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
Memory Density
9437184 bit
9437184 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
144
144
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX36
256KX36
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
BICMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIMM144,32
Standby Voltage-Min
3.14 V
Supply Current-Max
1 mA
Terminal Pitch
0.8 mm
Compare MCM36F8DG10 with alternatives
Compare CYM9272APM-50C with alternatives