MCM32216SG60
vs
IBM11D2320LD-60
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
IBM MICROELECTRONICS
Package Description
SIMM, SSIM72
SIMM, SSIM72
Reach Compliance Code
unknown
unknown
Access Time-Max
60 ns
60 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PSMA-N72
R-PSMA-N72
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FAST PAGE DRAM MODULE
FAST PAGE DRAM MODULE
Memory Width
32
32
Number of Terminals
72
72
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX32
2MX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SIMM
SIMM
Package Equivalence Code
SSIM72
SSIM72
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
1024
1024
Seated Height-Max
31.75 mm
25.4 mm
Self Refresh
NO
NO
Standby Current-Max
0.004 A
0.004 A
Supply Current-Max
0.374 mA
0.334 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
SINGLE
SINGLE
Base Number Matches
3
1
ECCN Code
EAR99
HTS Code
8542.32.00.02
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