MCL2V0603-3R0-R
vs
MLG0603S3N0ST
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
EATON CORP
|
TDK CORP
|
| Package Description |
CHIP
|
0201
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
Eaton
|
|
| Case/Size Code |
0201
|
0201
|
| Construction |
Rectangular
|
Multilayer Chip
|
| Core Material |
CERAMIC
|
CERAMIC
|
| DC Resistance |
0.26 Ω
|
0.3 Ω
|
| Inductance-Nom (L) |
0.003 µH
|
0.003 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.3 mm
|
0.3 mm
|
| Package Length |
0.6 mm
|
0.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.3 mm
|
0.3 mm
|
| Packing Method |
TR, 7 Inch
|
TR
|
| Quality Factor-Min (at L-nom) |
14
|
4
|
| Rated Current-Max |
0.3 A
|
0.3 A
|
| Self Resonance Frequency |
8600 MHz
|
6200 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
NO
|
NO
|
| Special Feature |
MULTI LAYER
|
INDUCTANCE TOLERANCE IS 0.3 NANO HENRY
|
| Surface Mount |
YES
|
YES
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
10%
|
10%
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8504.50.80.00
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
TIN
|
| Test Frequency |
|
100 MHz
|
|
|
|
Compare MCL2V0603-3R0-R with alternatives
Compare MLG0603S3N0ST with alternatives