MCIMX6X4EVM10AB
vs
MCIMX6U5DVM10AC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
MABGA-529
MABGA-624
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
13 Weeks
Samacsys Manufacturer
NXP
NXP
JESD-30 Code
S-PBGA-B529
S-PBGA-B624
JESD-609 Code
e1
e1
Length
19 mm
21 mm
Moisture Sensitivity Level
3
3
Number of Terminals
529
624
Operating Temperature-Max
105 °C
95 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA529,23X23,32
BGA624,25X25,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
1.52 mm
1.6 mm
Supply Voltage-Max
1.5 V
1.5 V
Supply Voltage-Min
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
19 mm
21 mm
uPs/uCs/Peripheral ICs Type
SoC
SoC
Base Number Matches
1
2
Compare MCIMX6X4EVM10AB with alternatives
Compare MCIMX6U5DVM10AC with alternatives