MCIMX6X1CVO08AB
vs
MCIMX6U8DVM10AC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
NXP
|
|
JESD-609 Code |
e1
|
e1
|
Moisture Sensitivity Level |
3
|
3
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
Package Description |
|
21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-2240
|
ECCN Code |
|
5A992
|
HTS Code |
|
8542.31.00.01
|
Address Bus Width |
|
16
|
Boundary Scan |
|
YES
|
External Data Bus Width |
|
64
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-PBGA-B2240
|
Length |
|
21 mm
|
Low Power Mode |
|
YES
|
Number of Terminals |
|
2240
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LFBGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
|
1.5 mm
|
Speed |
|
1000 MHz
|
Surface Mount |
|
YES
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
21 mm
|
|
|
|