MCIMX6U5DVM10AC vs AM3352BZCZA60 feature comparison

MCIMX6U5DVM10AC NXP Semiconductors

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AM3352BZCZA60 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description MABGA-624 NFBGA-324
Reach Compliance Code compliant compliant
ECCN Code 5A992.C 5A992.C
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP Texas Instruments
JESD-30 Code S-PBGA-B624 S-PBGA-B324
JESD-609 Code e1 e1
Length 21 mm 15 mm
Moisture Sensitivity Level 3 3
Number of Terminals 624 324
Operating Temperature-Max 95 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA624,25X25,32 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 1.6 mm 1.4 mm
Supply Voltage-Max 1.5 V 1.144 V
Supply Voltage-Min 1.35 V 1.056 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 21 mm 15 mm
uPs/uCs/Peripheral ICs Type SoC MICROPROCESSOR, RISC
Base Number Matches 2 1
Pbfree Code Yes
Address Bus Width 28
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 26 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
Low Power Mode YES
Number of DMA Channels 64
On Chip Data RAM Width 8
Qualification Status Not Qualified
RAM (words) 131072
Speed 600 MHz
Supply Current-Max 400 mA
Supply Voltage-Nom 1.1 V

Compare MCIMX6U5DVM10AC with alternatives

Compare AM3352BZCZA60 with alternatives