MCIMX31LCVMN4C
vs
MPC8308CVMADD
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-473
|
19 X 19 MM, 0.80 MM PITCH, 1.39 MM HEIGHT, LEAD FREE, MAPBGA-473
|
Pin Count |
473
|
473
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
UNAVAILABLE FOR IMPORT OR SALE IN US
|
|
Address Bus Width |
26
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
75 MHz
|
266 MHz
|
External Data Bus Width |
16
|
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B473
|
S-PBGA-B473
|
JESD-609 Code |
e1
|
e2
|
Length |
19 mm
|
19 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
473
|
473
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
Seated Height-Max |
1.54 mm
|
1.54 mm
|
Speed |
400 MHz
|
266 MHz
|
Supply Voltage-Max |
1.47 V
|
1.05 V
|
Supply Voltage-Min |
1.22 V
|
0.95 V
|
Supply Voltage-Nom |
1.4 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
TIN COPPER/TIN SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
3
|
2
|
|
|
|