MCIMX31CVMN4CR2
vs
MPC8308ZQADDA
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
MAPBGA-473
|
,
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
5A992.C
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-PBGA-B473
|
|
| JESD-609 Code |
e1
|
e0
|
| Length |
19 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
473
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA473,23X23,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.54 mm
|
|
| Supply Voltage-Max |
1.47 V
|
|
| Supply Voltage-Min |
1.22 V
|
|
| Supply Voltage-Nom |
1.4 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
19 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare MCIMX31CVMN4CR2 with alternatives