MCIMX31CJMN4D
vs
MPC8308CVMAFD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
MAPBGA-473
19 X 19 MM, 0.80 MM PITCH, 1.39 MM HEIGHT, LEAD FREE, MAPBGA-473
Pin Count
473
473
Reach Compliance Code
unknown
unknown
ECCN Code
5A002.A
HTS Code
8542.31.00.01
JESD-30 Code
S-PBGA-B473
S-PBGA-B473
Length
19 mm
19 mm
Moisture Sensitivity Level
3
3
Number of Terminals
473
473
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA473,23X23,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.54 mm
1.54 mm
Supply Voltage-Max
1.47 V
1.05 V
Supply Voltage-Min
1.22 V
0.95 V
Supply Voltage-Nom
1.4 V
1 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
TIN COPPER/TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
SoC
MICROPROCESSOR
Base Number Matches
3
2
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
333 MHz
Format
FIXED POINT
Integrated Cache
YES
JESD-609 Code
e2
Low Power Mode
YES
Speed
266 MHz
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