MCIMX27MJP4A
vs
MCIMX31LVMN5CR2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473
|
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-473
|
| Pin Count |
473
|
473
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A002.A
|
5A002
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
ALSO OPERATES 1.3V AT 266MHZ
|
|
| JESD-30 Code |
S-PBGA-B473
|
S-PBGA-B473
|
| Length |
19 mm
|
19 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
473
|
473
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA473,23X23,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.54 mm
|
1.54 mm
|
| Supply Voltage-Max |
1.52 V
|
1.65 V
|
| Supply Voltage-Min |
1.38 V
|
1.55 V
|
| Supply Voltage-Nom |
1.45 V
|
1.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER OVER NICKEL
|
TIN SILVER COPPER OVER NICKEL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
19 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MCIMX27MJP4A with alternatives
Compare MCIMX31LVMN5CR2 with alternatives