We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

MCH2010L7686FGBU vs HVC2010L7686FBFP feature comparison

MCH2010L7686FGBU Ohmcraft

Buy Now Datasheet

HVC2010L7686FBFP Ohmcraft

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Contact Manufacturer Contact Manufacturer
Ihs Manufacturer OHMCRAFT OHMCRAFT
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e4 e0
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.76 mm 0.76 mm
Package Length 5.08 mm 5.08 mm
Package Style SMT SMT
Package Width 2.54 mm 2.54 mm
Packing Method Bulk
Rated Power Dissipation (P) 1 W 1 W
Resistance 768000000 Ω 768000000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Series MCH HVC
Size Code 2010 2010
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Gold (Au) Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 2000 V 2000 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare MCH2010L7686FGBU with alternatives

Compare HVC2010L7686FBFP with alternatives