MCH1206K6656FSFP
vs
HVC1206K6656FBBU
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
Ihs Manufacturer |
OHMCRAFT
|
OHMCRAFT
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.76 mm
|
0.76 mm
|
Package Length |
3.2 mm
|
3.2 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
1.6 mm
|
1.6 mm
|
Rated Power Dissipation (P) |
0.33 W
|
0.33 W
|
Resistance |
665000000 Ω
|
665000000 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Series |
MCH
|
HVC
|
Size Code |
1206
|
1206
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier
|
Tolerance |
1%
|
1%
|
Working Voltage |
1500 V
|
1500 V
|
Base Number Matches |
1
|
1
|
Packing Method |
|
Bulk
|
|
|
|
Compare MCH1206K6656FSFP with alternatives
Compare HVC1206K6656FBBU with alternatives