MCF5484CZP200
vs
MPC8245LZU266X
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Package Description |
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
|
LBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.67 MHz
|
66 MHz
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B388
|
S-PBGA-B352
|
| JESD-609 Code |
e0
|
|
| Length |
27 mm
|
35 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
388
|
352
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
1.65 mm
|
| Speed |
200 MHz
|
266 MHz
|
| Supply Voltage-Max |
3.6 V
|
1.9 V
|
| Supply Voltage-Min |
3 V
|
1.7 V
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
27 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Address Bus Width |
|
32
|
| External Data Bus Width |
|
32
|
|
|
|
Compare MCF5484CZP200 with alternatives
Compare MPC8245LZU266X with alternatives