MCF5481CZP166
vs
PPC405EX-SSD400T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
APPLIED MICRO CIRCUITS CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA388,26X26,40
BGA,
Pin Count
388
388
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
666.66 MHz
External Data Bus Width
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
388
388
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.65 mm
Speed
166.66 MHz
400 MHz
Supply Voltage-Max
1.58 V
1.3 V
Supply Voltage-Min
1.43 V
1.2 V
Supply Voltage-Nom
1.5 V
1.25 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MCF5481CZP166 with alternatives
Compare PPC405EX-SSD400T with alternatives