MCF5481CZP166 vs PPC405EX-SSD400T feature comparison

MCF5481CZP166 Motorola Mobility LLC

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PPC405EX-SSD400T Applied Micro Circuits Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC APPLIED MICRO CIRCUITS CORP
Part Package Code BGA BGA
Package Description BGA, BGA388,26X26,40 BGA,
Pin Count 388 388
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 666.66 MHz
External Data Bus Width 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B388
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 388 388
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.65 mm
Speed 166.66 MHz 400 MHz
Supply Voltage-Max 1.58 V 1.3 V
Supply Voltage-Min 1.43 V 1.2 V
Supply Voltage-Nom 1.5 V 1.25 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 2
Pbfree Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MCF5481CZP166 with alternatives

Compare PPC405EX-SSD400T with alternatives