MCF5480CZP166 vs MCF5482CZP166 feature comparison

MCF5480CZP166 NXP Semiconductors

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MCF5482CZP166 Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388 BGA, BGA388,26X26,40
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 50 MHz
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 1
Number of Terminals 388 388
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 166.66 MHz 166.66 MHz
Supply Voltage-Max 3.6 V 1.58 V
Supply Voltage-Min 3 V 1.43 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 4
Part Package Code BGA
Pin Count 388
Address Bus Width 32
External Data Bus Width 32
Package Equivalence Code BGA388,26X26,40

Compare MCF5480CZP166 with alternatives

Compare MCF5482CZP166 with alternatives