MCF5480CZP166
vs
MCF5481CVR166
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
ROCHESTER ELECTRONICS LLC
Package Description
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-388
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
66.67 MHz
External Data Bus Width
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
3
Number of Terminals
388
388
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
2.55 mm
2.55 mm
Speed
166.66 MHz
166.66 MHz
Supply Voltage-Max
1.58 V
3.6 V
Supply Voltage-Min
1.43 V
3 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
3
Pbfree Code
Part Package Code
BGA
Pin Count
388
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
40
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