MCF5475ZP266 vs MCF5472VR200 feature comparison

MCF5475ZP266 Freescale Semiconductor

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MCF5472VR200 Freescale Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, MS-034AAL-1, PBGA-388 27 X 27 MM, MS-034AAL-1, PBGA-388
Pin Count 388 388
Reach Compliance Code not_compliant compliant
ECCN Code 5A002 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0 e1
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 388 388
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40 BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 266.66 MHz 200 MHz
Supply Voltage-Max 1.58 V 1.58 V
Supply Voltage-Min 1.43 V 1.43 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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